Circuit board and manufacturing method therefor
US12101891B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 20, 2020 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | Jun 7, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09809
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of a circuit board includes: providing a first double-sided copper laminate including a dielectric layer, a first copper foil layer and a copper plating layer, wherein the dielectric layer, wherein the dielectric layer defines a groove, the copper plating layer includes a first copper plating portion in the groove and a second copper plating portion beside the first copper plating portion. A double-sided circuit substrate including base layer and two first wiring layers is provided, wherein each first wiring layer includes a signal line. Conductive paste blocks are disposed in the base layer and on both sides of the signal line; and a first double-sided copper laminate is stacked on each side of the double-sided circuit substrate, disposing the signal line in the groove. The conductive paste blocks are pressed electrically connect same to the second copper plating portions. The present disclosure further provides a circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.