Electronic device including housing and method for manufacturing the housing
US12101901B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2022 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | Dec 26, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/0283
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Various embodiments of the present disclosure relate to an electronic device including a housing and a method of manufacturing the housing. The electronic device includes a housing forming an exterior of the electronic device. The housing is constituted to include a non-conductive part including a non-conductive protrusion protruded from at least some area of the non-conductive part, a conductive deposition layer disposed on a top surface of the non-conductive part except on the non-conductive protrusion, and a decoration layer formed on the top of the conductive deposition layer. Accordingly, the housing is lightweight and can perform a function of an antenna radiator. Other various embodiments are possible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.