Display device having thin-film encapsulation layer located at a first dam and manufacturing method therefor
US12101961B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | Feb 1, 2019 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | Jan 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/8731
Abstract
A display device may include a substrate including a display area and a transmission area located on an outer side of the display area, a display unit in the display area on the substrate, a thin-film encapsulation layer that covers the display unit, and a first dam between the thin-film encapsulation layer and the transmission area on the substrate, and an end portion of the thin-film encapsulation layer may be located on an inner side of the first dam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.