Sensor film for endoscopic instruments
US12102346B2 · kind B2 · utility
0Cited by
3References
13Claims
0Family size
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Key dates
| Filing date | Dec 29, 2020 |
| Grant date | Oct 1, 2024 |
| Priority date | — |
| Expiry date | Aug 9, 2041 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B2562/227
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A sensor film comprising: a substrate core having a first surface and a second surface; at least one sensing element for sensing at least one property; a first conductive layer residing on the first surface, the first conductive layer having first solder mask coated thereon, and wherein the first conductive layer is grounded; and a second conductive layer residing on the second surface, the second conductive layer having a second solder mask coated thereon, and coupled to the at least one sensing element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.