Modular adhesive dispensing device

US12103033B2 · kind B2 · utility

Assignee

• Nordson Corporation · US

Inventors

• Robert J. Woodlief · Suwanee, US
• David R. Jeter · Woodstock, US
• Brian R. Sosebee · Flowery Branch, US
• Leonard J. Lanier · Duluth, US
• Enes Ramosevac · Duluth, US
• Peter W. Estelle · Norcross, US
• Jeffrey E. Owen · Suwanee, US
• James R. Beal · Woodstock, US
• Leslie J. Varga · Cumming, US
• John J. Daniels · Madison, US
• Ronald Ramspeck · Atlanta, US
• John M. Riney · Buford, US

Key dates

• Filing date: Sep 18, 2020
• Grant date: Oct 1, 2024
• Expiry date: Apr 10, 2041

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B29B13/022
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

An adhesive dispensing device (10) includes a melt module (12) including a housing (78) that defines a receiving space to receive adhesive and a heater (114) to heat the housing to melt the adhesive, and a control module (14) releasably connected to the melt module. The control module includes a controller (36) to automatically recognize a characteristic associated with the melt module and operate the melt module using instructions stored on the controller that correspond to the characteristic of the melt module. A method of operating the adhesive dispensing device is also disclosed.