Bonding method and bonding device
US12103240B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 20, 2019 |
| Grant date | Oct 1, 2024 |
| Priority date | — |
| Expiry date | Apr 30, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/7128
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Provided is a bonding method capable of bonding with an inexpensive structure while avoiding an increase in the overall size of the device. The bonding method comprises: an arrangement step for locating a cylindrical body between two sheet-shaped members; a cylindrical body bonding step for applying an ultrasonic wave from the outer surface of a first sheet-shaped member through a horn part and applying heat from the outer surface of a second sheet-shaped member through an anvil part, in a state in which the cylindrical body is arranged between the two sheet-shaped members; and a shoulder part bonding step for directly bonding, through a pair of heating parts, the two sheet-shaped members to each other while the two sheet-shaped members are interposed between the pair of heating parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.