Enhanced strength of glass by combining redraw and chemical thinning processes
US12103885B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Aug 6, 2019 |
| Grant date | Oct 1, 2024 |
| Priority date | — |
| Expiry date | Aug 25, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C2204/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A cover element for an electronic device that includes a glass element having a thickness from 20 μm to 125 μm, a first primary surface, a second primary surface, a compressive stress region extending from the first primary surface to a first depth, and a polymeric layer disposed over the first primary surface. Further, the glass element has a stress profile such that it has a bend strength of about 1850 MPa or more at a 10% failure probability, wherein the cover element is made by a multi-step method that employs a redraw thinning step and at least two chemical etching steps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.