Bonded structure and method for producing same
US12104099B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | Jul 7, 2021 |
| Grant date | Oct 1, 2024 |
| Priority date | — |
| Expiry date | Nov 17, 2042 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16B11/006
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A bonded structure has a first substrate composed of aluminum or an aluminum alloy, a first thin film layer formed on the surface of the first substrate, and a resin adhesive layer bonded to the surface of the first thin film layer. The first thin film layer is composed of silicate glass that has a metal element with different valency from Si as a solid solution. The resin adhesive layer includes a resin including a structural site derived from ionic polymerization or a resin capable of dehydration condensation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.