Thermal metamaterials for directional emission in heat transfer systems
US12104864B2 · kind B2 · utility
0Cited by
4References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 27, 2022 |
| Grant date | Oct 1, 2024 |
| Priority date | — |
| Expiry date | Nov 18, 2042 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2245/06
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A multi-mode heat transfer system includes an emitter device with an inner core surrounded by an outer core having an outer surface and an emission surface disposed on the outer surface. The emission surface includes a thermal metamaterial configured to direct heat from the inner core in at least two desired directions to an object other than the emitter device. The object can include a thermal receiver devices, for example two receiver devices and the emission surface can direct heat to two different receiver devices spaced apart from the emitter device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.