Apparatus for inspecting substrate and method for fabricating semiconductor device using the same
US12105027B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2022 |
| Grant date | Oct 1, 2024 |
| Priority date | — |
| Expiry date | Dec 8, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2003/0093
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for fabricating a semiconductor device is provided. The method includes: loading a substrate on a stage of an apparatus for inspecting the substrate; extracting a first light having a first wavelength from a light by using a light source; acquiring first position information on at least one focal point, formed on the substrate, based on the first wavelength by using a controller, the at least one focal point being a pre-calculated at least one focal point; adjusting a position of at least one from among an objective lens and at least one microsphere in a vertical direction by using the first position information in the controller; condensing the first light, which has passed through the at least one microsphere, on the at least one focal point formed on the substrate; and inspecting the substrate by using the first light condensed on the at least one focal point.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.