Assembly, in particular in a microlithographic projection exposure apparatus
US12105434B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2022 |
| Grant date | Oct 1, 2024 |
| Priority date | — |
| Expiry date | Jun 9, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B5/09
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An assembly, for example in a microlithographic projection exposure apparatus, comprises an optical element and a joint arrangement for mechanically bearing the optical element. The joint arrangement comprises at least one connecting element secured on the optical element. The mass of the connecting element is distributed over its length so that the moment of inertia of the connecting element is increased in comparison with a connecting element of identical mass and length in which the mass is distributed uniformly over the length.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.