Patent · US Active

Adhesive transfer stamp and method for transferring a semiconductor chip using an adhesive transfer stamp

US12106980B2 · kind B2 · utility

0Cited by

2References

19Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Hubert Halbritter · Dietfurt, DE
Alexander F. Pfeuffer · Regensburg, DE
Mikko Peraelae · Tampere, FI

Key dates

Filing date	Jul 22, 2019
Grant date	Oct 1, 2024
Priority date	—
Expiry date	Jan 14, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/683
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In an embodiment an adhesive transfer stamp for transferring semiconductor chips includes a volume region including an electrically insulating material, at least one adhesive surface configured to receive a semiconductor chip and an electrically conductive element configured to electrically conductively connected to a ground conductor during operation and to dissipate electrical charges from the semiconductor chip to the ground conductor, wherein the volume region is embodied as a solid body, and wherein the volume region has at least one stepped structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.