Method of chip transferring and device/module having gas guiding structures with suction openings and intake opening to apply predetermined pressure uniformly on back side of transferring substrate
US12106981B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2021 |
| Grant date | Oct 1, 2024 |
| Priority date | — |
| Expiry date | Jan 6, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip-transferring module, and a device and a method for transferring and bonding chips are provided. The chip-transferring module includes a mounting main body, a light-transmitting member, a first gas guiding structure and a second gas guiding structure. The mounting main body has a first accommodating space and a second accommodating space. The light-transmitting member is disposed in the first accommodating space. The first gas guiding structure is disposed in the mounting main body and has a plurality of suction openings exposed out of the mounting main body. The second gas guiding structure is disposed in the mounting main body and has at least one intake opening communicating with the second accommodating space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.