Cooling structure and electrical apparatus
US12107033B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 21, 2020 |
| Grant date | Oct 1, 2024 |
| Priority date | — |
| Expiry date | Oct 15, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3675
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling structure includes: a main body receiving heat from a heat source and releasing the heat through a heat dissipation surface and a plurality of heat dissipation fins; a lid member having an air inlet and a fastened portion fastened to the main body; and a fan mechanism. The lid member is disposed to cover a plurality of heat dissipation fins from a side of respective top ends and thereby form a flow path. The fan mechanism has a fan main body that generates airflow, and a seating that holds the fan main body and attaches the fan main body to the lid member. The seating is subjected to an urging force applied from the main body to the seating, or fastened to the main body by a fastener. The cooling structure has a configuration that can suppress generation of vibration of the lid member forming the flow path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.