Microelectronic support for millimeter-wave communication including a transmission line trace and via pad spaced apart from a respective anti-trace and anti-pad
US12107314B2 · kind B2 · utility
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3References
17Claims
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Key dates
| Filing date | Jun 25, 2020 |
| Grant date | Oct 1, 2024 |
| Priority date | — |
| Expiry date | Feb 1, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/087
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.