Assembly techniques and cooling manifold configuration for high-power laser systems
US12107386B2 · kind B2 · utility
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2References
29Claims
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Key dates
| Filing date | Nov 25, 2020 |
| Grant date | Oct 1, 2024 |
| Priority date | — |
| Expiry date | Mar 20, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4087
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In various embodiments, laser resonators include enclosed cooling manifolds defining protrusions each configured to conduct heat-exchange fluid to a beam emitter in the resonator. Installation of such cooling manifolds may be facilitated via use of a rigid installation tool functioning as a mechanical reference, prior to installation of the beam emitters and sealing of the beam emitters to the cooling manifold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.