Two-phase immersion-type heat dissipation structure having fins for facilitating bubble generation
US12108574B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2022 |
| Grant date | Oct 1, 2024 |
| Priority date | — |
| Expiry date | Jun 13, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/203
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A two-phase immersion-type heat dissipation structure having fins for facilitating bubble generation is provided. The two-phase immersion-type heat dissipation structure includes a heat dissipation substrate, and a plurality of fins. The heat dissipation substrate has a fin surface and a non-fin surface that face away from each other, the non-fin surface is configured to be in contact with a heat source immersed in a two-phase coolant, and the fin surface is connected with the plurality of fins. More than half of the fins are functional fins, and at least one side surface of each of the functional fins and the fin surface have an included angle therebetween that is from 80 degrees to 100 degrees. A center line average roughness (Ra) of the side surface is less than 3 μm, and a ten-point average roughness (Rz) of the side surface is not less than 12 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.