Direct cooling of a power converter by using a stamped plate

US12108580B2 · kind B2 · utility

Assignees

• AUDI AG · DE
• Hitachi Energy Ltd · CH

Inventors

• Thomas Gradinger · Aarau, CH
• Andreas Apelsmeier · Pollenfeld, DE
• Benjamin SÖHNLE · Ingolstadt, DE
• Daniele Torresin · Baden, CH

Key dates

• Filing date: Feb 27, 2020
• Grant date: Oct 1, 2024
• Expiry date: May 18, 2040

Classification

• Technology area (CPC —): General

Abstract

A power converter including a semiconductor module having a base plate and a cooling housing. The cooling housing includes a receptacle plate and a cover. The receptacle plate has an opening. The receptacle plate is connected to the base plate of the semiconductor module around the opening. The cover is connected to the receptacle plate along a closure path around the opening, and either the receptacle plate or the cover is formed as a stamped or deep-drawn plate.