Layer forming apparatus, method of forming powder layer, and recording medium
US12109614B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | May 3, 2022 |
| Grant date | Oct 8, 2024 |
| Priority date | — |
| Expiry date | May 14, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A layer forming apparatus includes a loading unit including a stage onto which powder is supplied, a rotator that flattens the powder on the stage to form a powder layer, and circuitry. The circuitry causes the rotator to move in a first direction parallel to a surface of the stage and rotate while contacting the powder on the stage to form the powder layer. Further, the circuitry causes the rotator to move in a second direction opposite to the first direction and rotate while contacting surplus powder not on the stage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.