Filled polyamide moulding compounds, moulded articles produced therefrom, and use of the filled polyamide moulding compounds
US12110392B2 · kind B2 · utility
0Cited by
45References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2021 |
| Grant date | Oct 8, 2024 |
| Priority date | — |
| Expiry date | May 10, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K7/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to filled polyamide moulding compounds with a high heat-ageing resistance which, besides a specific polyamide mixture, also comprise at least one filler, at least one unsubstituted or substituted metallocene and optionally at least one additive. The invention also relates to the use of these polyamide moulding compounds to produce moulded articles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.