Floor board and method for manufacturing such floor boards
US12110693B1 · kind B1 · utility
3Cited by
1References
31Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 27, 2024 |
| Grant date | Oct 8, 2024 |
| Priority date | — |
| Expiry date | Mar 27, 2044 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE04F2201/0552
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A floor board including a decorative surface layer applied to a substrate, where the substrate is optionally MDF or HDF material at a side edge thereof, and at least one side edge together with a side edge opposite thereto forming a first pair of opposite side edges of said substrate. The first pair of opposite side edges includes mechanical first and second coupling parts, respectively, allowing the floor board to couple at the respective side edges with a similar floor board. Also, a floor board covering consisting of a plurality of the floor boards connected to one another, and a method for manufacturing such floor boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.