Modular active valve system having a reduced footprint for use in a smaller shock platform
US12110943B2 · kind B2 · utility
0Cited by
11References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 15, 2020 |
| Grant date | Oct 8, 2024 |
| Priority date | — |
| Expiry date | Apr 9, 2042 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16F2234/02
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A modular active valve system having a reduced footprint for use in a smaller shock platform is disclosed. The modular active valve system includes a multi-stage valve having a first stage and at least a second stage, wherein at least the first stage includes a semi-active valve for electronic damping control.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.