Resistive pressure sensor with improved structure design
US12111218B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2023 |
| Grant date | Oct 8, 2024 |
| Priority date | — |
| Expiry date | Sep 27, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L1/2293
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A transparent resistive pressure sensor and method of making the same are disclosed. The transparent resistive pressure sensor may include a flexible pressure substrate, a pressure electrode layer, an elastic dielectric spacer with microstructure, a transparent pressure-sensitive composite layer composed of a transparent polymer dielectric matrix and a conductive one-dimensional nanomaterial oriented substantially in a thickness direction of the transparent pressure-sensitive composite layer, a support electrode layer, and a support substrate, where the elastic dielectric spacer with microstructure may include a transparent elastic dielectric film and a plurality of size-varied straight holes penetrating through the transparent elastic dielectric film in a thickness direction of the transparent elastic dielectric film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.