Multi-physics co-simulation method of power semiconductor modules
US12112110B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 18, 2022 |
| Grant date | Oct 8, 2024 |
| Priority date | — |
| Expiry date | Mar 4, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/06
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present invention belongs to the technical field of simulation of power semiconductor modules, and discloses a multi-physics co-simulation method of a power semiconductor module. The multi-physics co-simulation method of the power semiconductor module comprises: adopting professional circuit simulation software PSpice supporting a spice model to be imported into a device, and by designing a specific collaborative analysis method and performing secondary development of a software data exchange interface, i.e. constructing a coupling interface of co-simulation, performing electricity-heat-force co-simulation of two types of software PSpice and COMSOL by adopting an indirect coupling manner. The simulation time is greatly shortened, and the simulation efficiency is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.