Film formation apparatus, film formation method, and method for fabricating semiconductor device
US12112955B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Aug 31, 2021 |
| Grant date | Oct 8, 2024 |
| Priority date | — |
| Expiry date | Nov 14, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/332
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A film forming apparatus includes an electrode, a target holder configured to hold a film forming target so as to face the electrode, and a masking shield holder configured to hold a masking shield between the electrode and the target holder. The masking shield includes a lattice portion having a plurality of openings therein and a frame portion supporting the lattice portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.