Wafer processing system
US12112958B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2023 |
| Grant date | Oct 8, 2024 |
| Priority date | — |
| Expiry date | Nov 28, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/304
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a wafer processing system comprising a processing tank, a cleaning device and a drying device. The processing tank has a cantilever rotating device and a dynamic balance correction device. The cantilever rotating device has a holding part for holding a wafer of a variety of specification parameters and causing the wafer to rotate along a rotating shaft of the cantilever rotating device. The dynamic balance correction device performs a corresponding dynamic balance correction on the cantilever rotating device, so that the cantilever rotating device is in a dynamic balance state during rotation. A dynamic nozzle unit of the cleaning device ejects a cleaning fluid to clean the rotating wafer. The drying device is used to dry the rotating wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.