Methods of calibrating an ultrasonic characteristic on a wire bonding system
US12113043B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2022 |
| Grant date | Oct 8, 2024 |
| Priority date | — |
| Expiry date | Mar 21, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/386
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of calibrating an ultrasonic characteristic on a wire bonding system is provided. The method includes the steps of: (a) determining a reference ultrasonic characteristic for formation of a wire bond; (b) determining a reference non-stick ultrasonic characteristic that results in a non-stick wire bond condition; (c) determining a calibration non-stick ultrasonic characteristic, on a wire bonding system to be calibrated, that results in a non-stick wire bond condition; and (d) determining a calibration factor for the wire bonding system to be calibrated using the reference non-stick ultrasonic characteristic and the calibration non-stick ultrasonic characteristic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.