Polishing slurry, method for manufacturing a display device using the same and display device
US12113077B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 13, 2020 |
| Grant date | Oct 8, 2024 |
| Priority date | — |
| Expiry date | Dec 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/471
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing slurry is disclosed which includes about 0.01 wt % to about 10 wt % of polishing particles, about 0.005 wt % to about 0.1 wt % of a dispersing agent, about 0.001 wt % to about 1 wt % of an oxide-polishing promoter including a pyridine compound, about 0.05 wt % to about 0.1 wt % of a nitride-polishing inhibitor including an amino acid or an anionic organic acid, and water. A method for manufacturing a display device including an active pattern disposed on a base substrate, a gate metal pattern including a gate electrode overlapping the active pattern, a planarized insulation layer disposed on the gate metal pattern, and a source metal pattern disposed on the planarized insulation layer is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.