Dual-stripline with crosstalk cancellation
US12113265B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2021 |
| Grant date | Oct 8, 2024 |
| Priority date | — |
| Expiry date | Feb 9, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/6627
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electronic structures including a dual-stripline with crosstalk cancellation are described. In an example, a printed circuit board (PCB), a package substrate or a semiconductor die includes a dual-stripline structure. The dual-stripline structure includes a first region including a first top line vertically over a first bottom line, and a second top line vertically over a second bottom line. The dual-stripline structure also includes a second region including the first top line vertically over the second bottom line, and the second top line vertically over the first bottom line. The dual-stripline structure also includes a transition region between the first region and the second region. The first bottom line and the second bottom line cross in the transition region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.