Micro-ground vias for improved signal integrity for high-speed serial links
US12114419B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2022 |
| Grant date | Oct 8, 2024 |
| Priority date | — |
| Expiry date | Jul 8, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An information handling system includes a printed circuit board, a surface mount connector including first and second surface mount connector portions, first and second different pairs, and a ground plane. The first and second surface mount connector portions are mounted on the printed circuit board. The first differential pair is located on the first surface mount connector portion, and the second differential pair is located on the second surface mount connector portion. The ground plane is located in between the first and second surface mount connector portions within the printed circuit board. The first ground via is in physical communication with the ground plane and a first ground pad on a surface of the printed circuit board. The second ground via is in physical communication with the ground plane and a second ground pad on the surface of the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.