Core shell with various filler materials for enhanced thermal conductivity
US12114453B2 · kind B2 · utility
0Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2019 |
| Grant date | Oct 8, 2024 |
| Priority date | — |
| Expiry date | Jun 21, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/1633
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.