Heat pipe with in-plane heat spreader and loading mechanism
US12114466B2 · kind B2 · utility
0Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2020 |
| Grant date | Oct 8, 2024 |
| Priority date | — |
| Expiry date | Feb 6, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2023/4087
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, one or more heat sources over the substrate, one or more heat pipes thermally coupled to the one or more heat sources, a heat spreader coupled to the one or more heat pipes, where the heat spreader is in-plane with the heat pipe, and one or more loading mechanisms coupled to at least a portion of the one or more heat pipes and to the substrate. The one or more loading mechanisms are in-plane with the spreader and the one or more heat pipes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.