Method for manufacturing thermoelectric conversion module
US12114568B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2021 |
| Grant date | Oct 8, 2024 |
| Priority date | — |
| Expiry date | Nov 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N10/857
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Provided is a method for manufacturing a thermoelectric conversion module that eliminates the need for supports and solder materials, allows collective and efficient production of a plurality of thin thermoelectric conversion modules, and includes the following steps (A) to (D): (A) disposing a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material on a support so as to be spaced apart from each other; (B) filling an insulator between the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material to obtain an integrated body including the chip of the P-type thermoelectric conversion material, the chip of the N-type thermoelectric conversion material, and the insulator; (C) peeling the integrated body obtained in step (B) from the support; and (D) connecting the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material via an electrode in the integrated body after step (C).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.