Patent · US Active

Polishing device

US12115620B2 · kind B2 · utility

0Cited by
5References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 30, 2019
Grant dateOct 15, 2024
Priority date
Expiry dateJun 7, 2041

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB24D13/18
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A polishing device is held on a robot arm and has a support plate, a polishing disc held on the support plate, a drive moving the support plate in a plane, and a metering device for feeding a polishing agent to the working side of the polishing disc. An application nozzle of the metering device is guided through an open central axis of the support plate, the polishing disc having a central opening for allowing the passage of the polishing agent metered in computer-controlled manner.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.