Device for supporting MEMS and/or ASIC components
US12116270B2 · kind B2 · utility
0Cited by
0References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2022 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | Feb 27, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2207/097
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A device including a first layer, a MEMS component and/or an ASIC component on the first layer, and a second layer having a cavity receiving the MEMS component and/or the ASIC component. The second layer has a feedthrough for transmission of at least one of an electrical signal, an electromagnetic signal, a fluid, and a force.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.