Wafer cup
US12116434B2 · kind B2 · utility
0Cited by
0References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2020 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | Apr 8, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2327/18
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer cup including a copolymer containing a tetrafluoroethylene unit and a fluoro(alkyl vinyl ether) unit. A water contact angle of at least a part of an inner surface of the wafer cup is 80 degrees or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.