Mask, mask fabrication method, and mask assembly
US12116660B2 · kind B2 · utility
0Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2021 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | Nov 4, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/166
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A mask, a mask assembly, and a method of fabricating a mask are disclosed herein. The mask comprises a polymer film in which at least one cell region and at least one peripheral region are defined, the at least one peripheral region surrounding the at least one cell region, a conductive layer disposed on the polymer film and including a metal, an inorganic layer disposed between the polymer film and the conductive layer and including a silicon-based inorganic material, and holes that penetrate the polymer film, the conductive layer, and the inorganic layer and overlap the at least one cell region in a plan view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.