High reliability, microchannel heat pipe array for improved efficiency, simplified charging/discharging and low-cost manufacture
US12117253B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2022 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | Jul 11, 2042 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2260/02
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Systems and method for providing a micro-channel array are provided. In some embodiments, a micro-channel array includes a plurality of micro-channels having a first end and a second end; where at least one of the first end and the second end allows fluid connectivity between the plurality of micro-channels. In some embodiments, the micro-channel array includes external manifolding for fluid connectivity between the plurality of micro-channels. In some embodiments, the micro-channel array includes internal manifolding for fluid connectivity between the plurality of micro-channels. This may solve one of the largest causes of low yields and poor performance consistency in the production process while at the same time simplifying production and reducing production costs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.