Hinge assembly and guide assembly for electronic devices using a heat carrying member

US12117876B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Prakash Kurma Raju · Kanchinakote, IN
• Samarth Alva · Bengaluru, IN
• Bhavaneeswaran Anbalagan · Bengaluru, IN
• Triplicane Gopikrishnan Babu · Hyderabad, IN
• Prasanna Pichumani · Kanchinakote, IN
• Raghavendra Doddi · Bengaluru, IN
• Sudheera Sudhakar · Kanchinakote, IN
• Ritu Bawa · Kanchinakote, IN

Key dates

• Filing date: Nov 21, 2020
• Grant date: Oct 15, 2024
• Expiry date: Feb 13, 2043

Classification

• Technology area (CPC G): Physics
• CPC primary: G06F2200/203
• WIPO field: Computer technology
• WIPO sector: Electrical engineering

Abstract

An electronic device may comprise a first chassis, a second chassis, and a hinge assembly configured to rotatably couple the first and second chassis together. The hinge assembly may include a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween. The hinge assembly may further include a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position. The electronic device may also include a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area. The size of the passage area may remain fixed.