Intelligent pattern recognition systems for wire bonding and other electronic component packaging equipment, and related methods
US12118726B2 · kind B2 · utility
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5References
18Claims
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Key dates
| Filing date | Jan 14, 2022 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | Jul 4, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V2201/06
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of operating a pattern recognition system of an electronic device packaging machine is provided. The method includes the steps of: (a) imaging a portion of a workpiece on an electronic device packaging machine using an image acquisition recipe; (b) utilizing a pattern recognition recipe in connection with an image from step (a) to determine if an acceptable level of matching occurs; and (c) automatically varying at least one parameter of at least one of (i) the image acquisition recipe and (ii) the pattern recognition recipe if the acceptable level of matching does not occur in step (b).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.