Integrated self-aligned assembly
US12119307B2 · kind B2 · utility
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2References
22Claims
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Key dates
| Filing date | Oct 18, 2021 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | Nov 12, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15323
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An assembly. In some embodiments, the assembly includes a first semiconductor chip, a substrate, and a first alignment element. The alignment of the first semiconductor chip and the substrate may be determined at least in part by engagement of the first alignment element with a first recessed alignment feature, in a surface of the first semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.