Microelectronic structures including bridges
US12119326B2 · kind B2 · utility
0Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2020 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | Jan 31, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.