Patent · US Active

Systems and methods for encapsulating an electronic component

US12119422B2 · kind B2 · utility

0Cited by

6References

14Claims

0Family size

Assignee

H.B. Fuller Company · US

Inventors

Peter Remmers · Hamburg, DE
Volker K. Kestler · Wrestedt, DE
Thomas F. Kauffman · Phillipsburg, US

Key dates

Filing date	Mar 6, 2020
Grant date	Oct 15, 2024
Priority date	—
Expiry date	Oct 19, 2040

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02E10/50
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method of encapsulating an electronic component. The method includes applying a first layer of an encapsulating composition onto an electronic component from an applicator roll, the electronic component being disposed on a substrate. The applicator roll comprises an outer surface and is spaced apart from the electronic component such that a gap exists between the applicator roll and the electronic component. The gap controls the thickness of the first layer of encapsulating composition. The first layer of encapsulating composition encapsulates the electronic component on the substrate. An interface between the surface of the electronic component and the encapsulating composition being substantially free of voids.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.