Electrode bonding system and method of use
US12119474B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 30, 2021 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | Dec 5, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01M10/0431
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A winding system includes a housing, a winding assembly, a bonding system, and a controller. The winding assembly is configured to wind electrode components about a mandrel to form a wound electrode arrangement. The bonding system includes an indexing assembly and a heating assembly. The indexing assembly includes a stationary support assembly and a transfer assembly moveably secured relative to the support assembly. The heating assembly is secured to a distal end of the transfer assembly. The heating assembly includes a housing that supports a distally extending resistive heating element. The controller operates the bonding system to effectuate a movement of the transfer assembly in a distal direction to apply a predetermined amount of pressure to an exterior of a wound electrode arrangement supported on the mandrel, and to heat the heating element to a predetermined temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.