Transversely-excited film bulk acoustic resonator package
US12119808B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2020 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | Nov 22, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/6406
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Acoustic resonator devices and filters are disclosed. A piezoelectric plate is attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A first conductor pattern is formed on a surface of the piezoelectric plate. The first conductor pattern includes interleaved fingers of an interdigital transducer disposed on the diaphragm, and a first plurality of contact pads. A second conductor pattern is formed on a back surface of an interposer, the second conductor pattern including a second plurality of contact pads. The interposer has layers of a LTCC circuit card, at least one layer of the tape comprising printed conductors. A plurality of conductive balls directly bonds the first plurality of contact pads formed on the plate to respective contact pads of the second plurality of contact pads formed on the interposer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.