Multi-dielectric printed circuit board
US12120811B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2020 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | Nov 24, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10159
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board (PCB), comprising a first layer, the first layer comprising a first dielectric material substantially exclusively. The PCB also comprises a second layer, the second layer comprising the first dielectric material within a first region and a second dielectric material within a second region adjacent to first region. The first dielectric material has a first dielectric constant, a first coefficient of thermal expansion (CTE) and a first glass transition temperature (Tg). The second dielectric material has a second dielectric constant, a second CTE and a second Tg. The first dielectric constant is greater than the second dielectric constant. The first CTE is substantially equal to the second CTE; and the first Tg and the second Tg are greater than 150° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.