Circuit board and method of manufacturing thereof
US12120812B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 29, 2021 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | Feb 8, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09045
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board includes a dielectric substrate, a signal line and a pair of ground wires. The dielectric substrate includes a base and an elevated platform protruding from an upper surface of the base. The signal line is conformally disposed on the dielectric substrate and includes a first segment disposed on an upper surface of the elevated platform, a second segment extending on the upper surface of the base, and a third segment disposed on a sidewall of the elevated platform and connecting the first segment and the second segment. The pair of ground wires are disposed on the dielectric substrate and are spaced apart from the signal line. A projection of the second segment of the signal line on the upper surface of the base partly overlaps projections of the pair of ground wires on the upper surface of the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.