Stretchable interconnect structure and method of fabricating the same
US12120814B2 · kind B2 · utility
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2References
16Claims
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Key dates
| Filing date | Jan 16, 2020 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | Sep 17, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10287
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A stretchable interconnect structure for electrically connecting electronic devices and a method of fabricating a stretchable interconnect structure for electrically connecting electronic devices. The method comprises the steps of providing an electrically conductive wire having a 3-dimensional helical form; and embedding the electrically conductive wire in a substrate made from an elastic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.