Multilayer substrate
US12120815B2 · kind B2 · utility
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17Claims
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Assignee
Inventor
Key dates
| Filing date | Jun 13, 2023 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | Jun 13, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4691
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer substrate includes an insulator that includes a first region and a second region that is thinner than the first region, and a first signal line and a second signal line that are structured to extend across the first region and the second region. In a region in which the first signal line and the second signal line face each other, a line width of the first signal line and a line width of the second signal line are smaller in the second region than in the first region, and a distance between the first signal line and the second signal line is smaller in the second region than in the first region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.