Electronic device including heat dissipation structure
US12120853B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2022 |
| Grant date | Oct 15, 2024 |
| Priority date | — |
| Expiry date | May 13, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2018
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to an embodiment of the disclosure, a wearable electronic device may include a housing, a first printed circuit board (PCB), a second PCB disposed in parallel with the first PCB, a first interposer, and a second interposer, and the housing may include at least one first opening formed on a first portion, and the first interposer and the second interposer may be disposed between the first PCB and the second PCB, the first interposer and the second interposer may be disposed to have a first end of the first interposer and a second end of the second interposer facing the first end, spaced apart by a designated distance, and a first space between the first end and the second end may be connected to the at least one first opening of the housing. Various other embodiments are possible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.